Rosin Solder Paste – RMA-223

Description

Specifications:
1. RMA-223 is a moderately active rosin type soldering paste, which is widely used in SMD repair process of mobile phone boards.
2. It is a wash-free soldering paste with very light color and very high SIR value. It is recommended to be used for BGA, CSP and other ball matrix solder joint repair and ball repair.
3. Each one includes a booster needle
4. Good insulation and smooth welding surface; No deterioration, no drying
5. Good immersion and high-strength joint, non-toxic and non-corrosive;

Package Included:
1 * Soldering paste
1 * Booster
1 * Needle